• Ceramic Plate CP Series - considered ‘the standard’ in the thermoelectric industry. Available in numerous heat pumping capacities, geometric shapes, and input power ranges. The CP Series is designed for higher current and large heat-pumping applications. For all CP Series thermoelectric coolers, wire is stranded, 114 mm (4.5 in.) long and PVC insulated.

• HiTemp ETX Series - offers higher efficiency and a 10% boost in heat pumping capacity than standard thermoelectric coolers. Features a higher thermal insulating barrier when compared to standard materials creating a maximum temperature differential (ΔT) of 83°C. This product series uses an enhanced thermoelectric module construction that prevents performance degradation in high temperature environments, making it ideal for cooling autonomous systems, machine vision and digital light processors. The HiTemp ETX Series is available in multiple configurations covering a wide range of footprints, cooling capacities and voltage ranges.

• UltraTEC™ UTX Series - offers a 10% boost in heat pumping capacity, greater temperature differential and higher efficiency than standard thermoelectric coolers. It is assembled with advanced thermoelectric materials and features a higher thermal insulating barrier when compared to standard materials, creating a maximum temperature differential (ΔT) of 72°C. The UltraTEC UTX thermoelectric cooler is ideal for spot cooling applications with industrial lasers, laser projectors, medical diagnostic systems and analytical instrumentation. The Series is offered in multiple configurations including various heat pumping capacities, geometric shapes and voltage options.

• Multistage MS Series - thermoelectric coolers are able to reach colder temperatures than single stage thermoelectric coolers. It offers the highest temperature differential (ΔT), up to 131°C. This product line is available in numerous temperature differentials, heat pumping capacities and geometric shapes. The Multistage MS Series is designed for higher current and lower heat-pumping applications. It is ideal for applications operating in a room temperature environment.

• Annular Series - The SH Series is an annular-style thermoelectric cooler. The hot and cold side ceramics have a circular hole in the center to accommodate light protrusion for optics, mechanical fastening or temperature probe. The RH Series is an annular thermoelectric cooler that is round in shape. The hot and cold side ceramics have a circular hole in the center to accommodate light protrusion for optics, mechanical fastening or temperature probe. The SH Series is designed for higher current and larger heat-pumping applications. For all SH and RH Series thermoelectric coolers, wire is stranded, 114 mm (4.5 in.) long and PVC insulated.

• PowerCycling PCX Series - thermoelectric cooler designed for thermal cycling between multiple temperature set points. The PowerCycling PCX Series is ideal for applications where fast temperature changes are required, such as medical and laboratory equipment. The module is specially constructed to reduce the amount of stress induced on the TE elements during operation. This product line has been tested to withstand more than 1M cycles without degradation in performance.

Laird Thermal Systems extensive product portfolio of thermoelectric coolers cover a wide range of cooling capacities, temperature differentials, input power requirements and geometric footprints. Standard finishing options are available to accommodate alternate lead lengths, lapping thickness tolerances, and moisture protective sealants. Standard pre-tinning and solder constructions are available to accommodate solderable mounting of the thermoelectric cooler to the heat exchanger, or processing of the thermoelectric cooler through a reflow oven to solder onto an optoelectronic package.

Thermoelectrics are ideal for applications that require active cooling to below ambient and have cooling capacity requirements < 600 Watts. A design engineer should consider thermoelectric coolers when the system design criteria include such factors as precise temperature control, high reliability, compact geometry constraints, low weight and environmentally friendly requirements.