IP67 Devices for Decentralised Installation
 
Most remarkable feature of the series PM-IP67A is the design suitable for applications with protection degree IP67. The worldwide unique thermoselective vacuum encapsulation process (EP 1 987 708, US Patent No. 8,821,778 B2) and a connection via special 7/8" connectors enable trouble-free use of the modules directly on-the-site.
 
The completely and permanently encapsulation of the power supply electronics enables a compression of the packing density, gives the modules an extremely resistant enclosure and makes them particularly durable and robust. Another positive effect in addition to a significant increase in life time is the resistant against mechanical stress (shock and vibration), dirt and dust and moisture. Therefore further additional protection against aggressive environmental influences in harsh environments are no longer necessary.
 
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