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374624B00032G by boyd laconia llc
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374624B00032G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized

RoHS Compliant
Packaging
Accessories
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374624B00032G
RoHS:
Yes
HTS:
8541900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
510
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
35 x 35 x 106714mm
Thermal Resistance:
23.46717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
Search Keywords:
374624B00032G
IN STOCK: 887
Can Ship immediately
Minimum Order:
5
Factory Lead-Time
14 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$5.21
$26.050
50
$4.23
$211.500
100
$4.04
$404.000
250
$3.92
$980.000
510
$3.71
$1,892.100
1,020
$3.61
$3,682.200
2,550
$3.11
$7,930.500
5,100 +
$3.06
$15,606.000
Suppliers Standard Package
Please Note: Item may be subject to tariff fee if shipping within the United States
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