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375324B00035G by boyd laconia llc
DATA SHEET

375324B00035G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized .. see full description

  • RoHS Compliant
  • Bulk Packaging
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375324B00035G
RoHS:
Yes
COO:
CN
Supplier Standard Pack:
1920
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
10.2 x 10.2 x 10.26714mm
Thermal Resistance:
71.46717°C/W
Finish:
Black Anodized6710
The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.
Search Keywords:
375324B00035G
IN STOCK: 318
Can Ship immediately
On Order:
1,920   can ship 2/26/25 
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
Factory Lead-Time
19 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$8.417
$42.085
100
$5.435
$543.500
250
$5.157
$1,289.250
480
$5.106
$2,450.880
960
$5.055
$4,852.800
1,440
$5.004
$7,205.760
1,920 +
$4.954
$9,511.680
Please Note: Item may be subject to tariff fee if shipping within the United States
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