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6030B-TTG

Boyd Laconia LLC

Heat Sink Passive TO-220 Vertical Thru-Hole Copper 12.5°C/W Tin .. see full description

RoHS Compliant
Bulk Packaging
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Supplier:
Boyd Laconia LLC
Part No:
6030B-TTG
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1000
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Solder Tab6706
Dimension:
25.4 x 12.7 x 29.976714mm
Thermal Resistance:
12.56717°C/W
Finish:
Tin6710
The AAVID THERMALLOY 6030B-TTG is a passive heat sink designed to efficiently dissipate heat from TO-220 semiconductor devices. It features a vertical thru-hole mounting configuration, making it easy to install on circuit boards. Made of high-quality copper, this heat sink offers excellent thermal conductivity and corrosion resistance. With a thermal resistance of 12.5°C/W, it effectively keeps the temperature of the TO-220 device low, preventing overheating. The heat sink is coated with a layer of tin for added durability and protection. Whether in industrial or electronic applications, the AAVID THERMALLOY 6030B-TTG ensures optimal thermal management and prolongs the lifespan of the components.
Search Keywords:
6030BTTG
IN STOCK: 15
Ships today, if you order in
On Order:
3,000   can ship 1/2/25 
Minimum Order:
5
Factory Lead-Time
8 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$4.728
$23.640
50
$3.885
$194.250
100
$3.569
$356.900
250
$3.395
$848.750
500
$3.307
$1,653.500
1,000
$2.742
$2,742.000
3,000
$2.702
$8,106.000
5,000 +
$2.675
$13,375.000
Please Note: Item may be subject to tariff fee if shipping within the United States
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