C&K COMPONENTS SD08H1SB is a low profile DIP (Dual In-line Package) that offers compact and streamlined design for electronic circuit boards. With its sleek form factor and efficient layout, this component is perfect for applications requiring space-saving solutions without compromising performance. Whether it's in consumer electronics, industrial automation, or telecommunications, the SD08H1SB delivers reliable and high-quality connections in a low-profile package. Trust C&K COMPONENTS for outstanding components that combine innovation, durability, and versatility.