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MCP1725-3302E/MC by microchip technology
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MCP1725-3302E/MC

Microchip Technology

LDO Regulator Pos 3.3V 0.5A Automotive 8-Pin DFN EP .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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Products found: 0
Supplier:
Microchip Technology
Part No:
MCP1725-3302E/MC
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
150
Package Type:
TUBE
Maximum Dropout Voltage @ Current:
0.35@500mA V
Junction to Case:
N/A
Accuracy:
±2 %
Line Regulation:
0.05(Typ) %/V
Junction to Ambient:
52(Typ) °C/W
Dimension:
2 x 3 x 0.95(Max) mm
Function:
LDO
Load Regulation:
0.5(Typ) %
Family:
MCP1725
Maximum Input Voltage:
6 V
The MICROCHIP TECH. MCP1725-3302E/MC is a low-dropout (LDO) regulator with a positive voltage output of 3.3V and a maximum current rating of 0.5A. Designed specifically for automotive applications, this regulator offers reliable and stable power supply to various electronic systems in a vehicle. The 8-Pin DFN EP package ensures compactness and easy integration into space-constrained designs.
Search Keywords:
MCP17253302EMC
  Different packaging options available.  See Alternatives
IN STOCK: 4,500
Can Ship immediately
Manufacturer Stock:
10,950   can ship 12/6/24
Minimum Order:
150
Multiple:
150
Factory Lead-Time
6 Weeks can ship 1/3/25  
Enter Quantity
Quantity
Unit Price
Ext. Price
150
$0.5373
$80.595
600
$0.5294
$317.640
1,050
$0.5241
$550.305
2,550
$0.5189
$1,323.195
5,100
$0.5137
$2,619.870
7,500
$0.5085
$3,813.750
10,050
$0.5035
$5,060.175
15,000 +
$0.4984
$7,476.000
Suppliers Standard Package
Tools/3D Models
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 15-May-2011 - QUALIFICATION OF GEAXX MASKS WITH THE CMP PROCESS
PDF PCN - 10-Jul-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 28-Feb-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 30-May-2011 - Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Lead Frame At Nseb (Utl)
PDF PCN - 28-Mar-2011 - Microchip is announcing the qualification of listed GEAxx masks with the CMP process in order to imp
PDF PCN - 17-Dec-2008 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 22-Feb-2011 - Microchip Is Announcing The Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Leadframe At Nseb
PDF PCN - 24-Jun-2009 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list