help desk software
MCP2122T-E/SN by microchip technology
DATA SHEET

MCP2122T-E/SN

Microchip Technology

Infrared Encoder/Decoder - 115.2KBd - 8-Pin SOIC N - Tape&Reel .. see full description

RoHS Compliant
REEL Packaging
Accessories
Request Programming Quote
This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP2122T-E/SN
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3300
Package Type:
REEL
Maximum Operating Supply Voltage:
5.5 V
Maximum Data Rate:
115.2 KBd
Dimension:
4.9 x 3.9 x 1.25(Min) mm
Family:
MCP2122
Minimum Operating Supply Voltage:
1.8 V
Category:
Infrared Encoder/Decoder
Mounting:
Surface Mount
The MCP2122T-E/SN is an infrared encoder/decoder module designed for easy integration into various applications. It operates at a high baud rate of 115.2KBd and features an 8-pin SOIC N package. This module is supplied in Tape&Reel packaging, ensuring efficient handling and storage. With its reliable infrared encoding and decoding capabilities, the MCP2122T-E/SN is an excellent choice for projects requiring seamless wireless communication.
Search Keywords:
MCP2122TESN
  Different packaging options available.  See Alternatives
IN STOCK: 2,150
Ships today, if you order in
Manufacturer Stock:
99,000   can ship 12/9/24
Minimum Order:
250
Factory Lead-Time
4 Weeks can ship 12/20/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
250
$0.793
$198.250
500
$0.781
$390.500
1,000
$0.769
$769.000
3,300
$0.758
$2,501.400
6,600
$0.746
$4,923.600
9,900
$0.735
$7,276.500
13,200 +
$0.724
$9,556.800
Suppliers Standard Package
Tools/3D Models
Request Free CAD Models
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse