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MCP23008-E/SO by microchip technology
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MCP23008-E/SO

Microchip Technology

I/O Expander - 8bit - 1.7 MHz - I2C - 1.8 to 5.5 V - SOIC W 18-Pin. .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23008-E/SO
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
42
Package Type:
TUBE
Maximum Operating Supply Voltage:
5.5 V
Manual Reset:
Yes
Family:
MCP23008
Interrupt Output:
Yes
I2C Bus Interface Mode:
Standard Mode,Fast Mode,Fast Mode Plus
Interface Speed:
1700 kHz
Interface Type:
I²C
Dimension:
11.55 x 7.5 x 2.05(Min) mm
The MCP23008-E/SO is a 8bit I/O expander with high speed I2C interface in 18 lead SOIC package. This I/O expander provides 8bit, general purpose parallel I/O expansion for I2C bus applications. The MCP23008 consists of multiple 8bit configuration registers for input, output and polarity selection. The system master can enable I/Os as either inputs or outputs by writing I/O configuration bits. Data for each input or output is kept in corresponding input or output register. The polarity of input port register can be inverted with polarity inversion register. All registers can be read by system master.
Search Keywords:
MCP23008ESO
  Different packaging options available.  See Alternatives
IN STOCK: 796
Ships today, if you order in
Minimum Order:
42
Multiple:
42
Factory Lead-Time
6 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
42
$1.152
$48.384
252
$1.029
$259.308
504
$1.019
$513.576
1,008
$1.009
$1,017.072
2,520
$0.999
$2,517.480
5,040
$0.989
$4,984.560
7,518
$0.979
$7,360.122
10,038 +
$0.969
$9,726.822
Suppliers Standard Package
Tools/3D Models
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 08-Mar-2007 -
PDF PCN - 07-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 13-Oct-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 11-Nov-2004 -
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 09-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 18-Feb-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 03-Nov-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 13-Oct-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 29-Jun-2016 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 12-Oct-2020 - QUALIFICATION OF QMI-519 DIE ATTACH MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 09-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 16-Aug-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 13-Feb-2021 - QUALIFICATION OF QMI-519 DIE ATTACH MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 07-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI