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MCP23S08-E/ML by microchip technology
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MCP23S08-E/ML

Microchip Technology

I/O Expander - 8bit - 10 MHz - SPI - 1.8 to 5.5 V - 20-Pin QFN - Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23S08-E/ML
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
91
Package Type:
TUBE
Maximum Operating Supply Voltage:
5.5 V
I2C Bus Interface Mode:
N/R
Family:
MCP23S08
Interface Speed:
10000 kHz
Interrupt Output:
Yes
Interface Type:
SPI
Dimension:
4 x 4 x 0.88 mm
Manual Reset:
Yes
The MCP23S08-E/ML is an 8-bit I/O expander ideally suited for applications requiring additional I/O pins in a compact package. With a 10 MHz SPI interface, this device can seamlessly extend the number of input/output pins in a wide range of embedded systems.Operating at a voltage range of 1.8 to 5.5 V, the MCP23S08-E/ML provides flexibility for use in various applications. Its 20-pin QFN packaging offers a compact form factor, making it suitable for space-constrained designs.This I/O expander from Microchip Technology offers a reliable and efficient solution for projects requiring additional I/O pins, enabling easy expansion and integration with existing systems. Packaged in a tube for convenient handling, the MCP23S08-E/ML is a reliable and versatile device that provides enhanced functionality to any platform requiring extra I/O capabilities.
Search Keywords:
MCP23S08EML
  Different packaging options available.  See Alternatives
IN STOCK: 1,547
Ships today, if you order in
Manufacturer Stock:
7,280   can ship 11/29/24
Minimum Order:
91
Multiple:
91
Factory Lead-Time
7 Weeks can ship 1/3/25  
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$1,251.250
2,548
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PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X
PDF PCN - 22-Feb-2011 - CCB 1029.02: QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 10-Jun-2011 - QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)
PDF PCN - 11-Nov-2004 -
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 22-Feb-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 08-Mar-2007 -
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 30-May-2011 - Ccb 1029.02: Qualification Of 16 & 20L Qfn (4X4) Packages With Eftec-64T Leadframe At Nseb (Utl)
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 30-Jun-2011 - Qualification Of 16 & 20L Qfn (4X4) Packages With Eftec-64T Leadframe At Nseb (Utl)
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 08-Mar-2007 - Product Change Notice