PIC12F675-I/P by microchip technology

PIC12F675-I/P

Microchip Technology

MCU 8 Bit - Flash - PIC12 Family PIC12F6xx Series Microcontrollers - 20 MHz - 1.75 KB - 64 Byte - 8 Pins. .. see full description

RoHS Compliant

TUBE Packaging

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Supplier:

Microchip Technology

Part No:

PIC12F675-I/P

RoHS:

Yes

HTS:

8542310015

COO:

TH

ECCN:

EAR99

Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

60

Package Type:

TUBE

Operating Temperature:

-40 to 85 °C

ADC Resolution:

10 bit

Number of Programmable I/Os:

68877

RAM Size:

648886B

Program Memory Type:

Flash8885

Program Memory Size:

1.758884KB

The PIC12F675-I/P is a 8-bit flash-based CMOS Microcontroller. The easy-to-program (only 35 single word instructions) CMOS Flash-based 8-bit microcontroller packs Microchip's powerful PIC® MCU architecture into an 8-pin package and features 4 channels for the10-bit Analogue-to-Digital (A/D) converter, 1-channel comparator and 128bytes of EEPROM data memory. The data memory is partitioned into two banks, which contain the general purpose registers and the special function registers. The special function registers are located in the first 32 locations of each bank. Register locations 20h-5Fh are general purpose registers, implemented as static RAM and are mapped across both banks. All other RAM is unimplemented and returns 0 when read. RP0 (STATUS<5>) is the bank select bit.

Product Highlights:

Potential Applications:

Search Keywords:

PIC12F675IP

IN STOCK: 6,240

Can Ship immediately

BONDED Quantity:

0

Manufacturer Stock:

129,435 can ship 12/6/24

On Order:

Minimum Order:

60

Available in less than min:

MOQ for out of Stock Qty:

Multiple:

60

Factory Lead-Time

4 Weeks can ship 12/20/24

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

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Min quantity should be greater than or equal () in order to activate the custom price. Otherwise you will get the normal price.

Quantity

Unit Price

Ext. Price

60

$1.512

$90.720

120

$1.497

$179.640

300

$1.482

$444.600

540

$1.468

$792.720

1,020

$1.453

$1,482.060

2,520

$1.438

$3,623.760

5,040

$1.424

$7,176.960

7,500 +

$1.410

$10,575.000

Suppliers Standard Package

Tools/3D Models

Product Guides

Product Changes

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 22-Jan-2004 - Product Change Notice

PCN - 01-Aug-2005 - Qualification Of 8L Dfn At Carsem

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 06-Nov-2003 - Product Change Notice

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 17-Jun-2008 - Microchip is announcing the qualification of G600 mold compound for 8L PDIP package at units for the

PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 21-Sep-2011 - Microchip is releasing the v9.83 HI-Tech C for the listed PIC10/12/16 MCUs in order to provide new s

PCN - 01-May-2010 - Data Sheet-Pic12F629/675 Data Sheet

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 07-May-2008 - Microchip is qualifying the G600 mold compound for 8L PDIP package at UNIS in order to improve manuf

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE

PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 28-May-2010 - QUALIFICATION OF 8L DFN (4X4) PACKAGE WITH CRM1076DJ DIE ATTACH AND G770HCD MOLD COMPOUND

PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP PACKAGE AT MMS

PCN - 27-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic12F629/675 Data Sheet Of Devices.

PCN - 18-Aug-2006 - Qualification Of 8L Dnf 4X4Mm At Unis

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 19-Sep-2008 - Microchip is qualifying E500 Mold Compound and 84-1LMISR4 Die Attach Epoxy for 8L PDIP Package at MM

PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 08-Mar-2007 - Product Change Notice

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS

PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 12-Mar-2003 - FIRMWARE CHANGE

PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 31-Dec-2006 - Addition Of An Assembly Site

PCN - 11-Nov-2004 - Product Change Notice

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo

PCN - 01-Sep-2005 - Qualification Of 8L Dfn At Nseb

PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS

PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 27-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic12F629/675 Family Silicon Errata And Data Sheet Cl

PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th

PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP AT MMS ASSEMBLY

PCN - 06-Mar-2006 - Product Change Notice

PCN - 27-Oct-2009 - Pic12F629/675 Family Silicon Errata And Data Sheet Clarification

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 01-Jun-2013 - Qualification Of 8L Vdfn (4X4X0.9 Mm) At Lpi Assembly Site

PCN - 19-Apr-2010 - Microchip is announcing the Qualification of 8L DFN (4x4) package with CRM1076DJ die attach and G770

PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY

PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 07-Oct-2005 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 27-Oct-2009 - Released A New Devicedoc For The Pic12F629/675 Data Sheet Of Devices

PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the

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