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PIC18F2553-I/SO by microchip technology
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PIC18F2553-I/SO

Microchip Technology

MCU 8-bit PIC RISC 32KB Flash 5V 28-Pin SOIC W Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
This product may require extra documentation. Shipping may be delayed 1-2 days.
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Products found: 0
Supplier:
Microchip Technology
Part No:
PIC18F2553-I/SO
RoHS:
Yes
HTS:
8542310015
ECCN:
3A991.a.2
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
27
Package Type:
TUBE
Number of Programmable I/Os:
24
Program Memory Size:
32 KB
RAM Size:
2 KB
Program Memory Type:
Flash
ADC Resolution:
12 bit
Operating Temperature:
-40 to 85 °C
The PIC18F2553-I/SO is a high-performance 8-bit microcontroller unit (MCU) from Microchip Technology, ideal for a wide range of applications. This MCU features a powerful RISC architecture, 32KB of flash memory, operates at 5V, and comes in a space-saving 28-pin SOIC package. The device is perfect for applications demanding high processing power and low power consumption. It is delivered in a tube packaging for added convenience and protection during transportation and storage.
Search Keywords:
PIC18F2553ISO
IN STOCK: 135
Ships today, if you order in
Manufacturer Stock:
1,026   can ship 11/29/24
Minimum Order:
5
Factory Lead-Time
4 Weeks can ship 12/13/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$8.07
$40.350
27
$7.68
$207.360
54
$7.61
$410.940
108
$7.53
$813.240
270
$7.45
$2,011.500
513
$7.38
$3,785.940
1,026 +
$7.31
$7,500.060
Suppliers Standard Package
Tools/3D Models
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 26-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic18F2458/2553/4458/4553 Data Sheet Of Devices.
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 26-Oct-2009 - Released A New Devicedoc For The Pic18F2458/2553/4458/4553 Data Sheet Of Devices