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44764-0802 by molex / waldom
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44764-0802

Molex / Waldom

Conn Wire to Board RCP 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

RoHS Compliant
Tray Packaging
Accessories
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Products found: 0
Supplier:
Molex / Waldom
Part No:
44764-0802
RoHS:
Yes
HTS:
8536694040
COO:
US
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Tray
Type:
Wire to Board
Body Orientation:
Right Angle
Gender:
RCP
Mounting:
Through Hole
Pitch:
3 mm
Number of Contacts:
8
Maximum Voltage Rating:
600 V
Maximum Current Rating:
5/Contact A
Termination Method:
Solder
Operating Temperature:
-40 to 105 °C
Conn Wire to Board RCP 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
Search Keywords:
447640802
IN STOCK: 4,099
Ships today, if you order in
Minimum Order:
20
Factory Lead-Time
17 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
20
$5.68
$113.600
260
$4.54
$1,180.400
520
$4.10
$2,132.000
1,040
$4.06
$4,222.400
2,500
$3.90
$9,750.000
5,000
$3.86
$19,300.000
10,000 +
$3.82
$38,200.000
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