374624B00032G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374624B00032G
RoHS:
Yes
HTS:
8541900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
510
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
35 x 35 x 106714mm
Thermal Resistance:
23.46717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
Search Keywords:
374624B00032G
IN STOCK:
887
Can Ship immediately
Minimum Order:
5
Factory Lead-Time
14 Weeks
Quantity
Unit Price
Ext. Price
5
$5.21
$26.050
50
$4.23
$211.500
100
$4.04
$404.000
250
$3.92
$980.000
510
$3.71
$1,892.100
1,020
$3.61
$3,682.200
2,550
$3.11
$7,930.500
5,100
+
$3.06
$15,606.000
Please Note:
Item may be subject to tariff fee if shipping within the United States
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