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374724B60024G by boyd laconia llc
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374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized

RoHS Compliant
Packaging
Accessories
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374724B60024G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
168
Package Type:
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Solder Anchor6706
Dimension:
35 x 35 x 186714mm
Thermal Resistance:
15.36717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
Search Keywords:
374724B60024G
IN STOCK: 1,850
Can Ship immediately
Minimum Order:
5
Factory Lead-Time
14 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$5.64
$28.200
50
$4.60
$230.000
168
$4.18
$702.240
336
$4.11
$1,380.960
504
$4.04
$2,036.160
1,008
$3.62
$3,648.960
2,520
$3.57
$8,996.400
5,040 +
$3.51
$17,690.400
Suppliers Standard Package
Please Note: Item may be subject to tariff fee if shipping within the United States
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