375324B00035G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375324B00035G
RoHS:
Yes
COO:
CN
Supplier Standard Pack
1920
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
10.2 x 10.2 x 10.26714mm
Thermal Resistance:
71.46717°C/W
Finish:
Black Anodized6710
The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.
Search Keywords:
375324B00035G
IN STOCK:
0
On Order:
1,920
can ship 2/26/25
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
Factory Lead-Time
19 Weeks
Quantity
Unit Price
Ext. Price
5
$9.05
$45.250
100
$8.60
$860.000
250
$8.17
$2,042.500
480
$7.76
$3,724.800
960
$4.11
$3,945.600
1,440
$2.89
$4,161.600
1,920
+
$2.83
$5,433.600
Please Note:
Item may be subject to tariff fee if shipping within the United States
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