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375424B00034G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375424B00034G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack 
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Search Keywords:
375424B00034G
IN STOCK:
103
Ships today, if you order in
On Order:
3,360
can ship 2/26/25
Minimum Order:
25
Factory Lead-Time
17 Weeks
Quantity
Unit Price
Ext. Price
25
$2.73
$68.250
100
$1.85
$185.000
250
$1.65
$412.500
500
$1.57
$785.000
1,000
$1.53
$1,530.000
3,360
$1.47
$4,939.200
6,720
$1.41
$9,475.200
10,080
+
$1.39
$14,011.200
Please Note:
Item may be subject to tariff fee if shipping within the United States
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