573300D00010G
Boyd Laconia LLCHeat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized .. see full description
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Supplier:
Boyd Laconia LLC
Part No:
573300D00010G
RoHS:
Yes
HTS:
8473309000
COO:
CN
Supplier Standard Pack
1500
Package Type:
REEL
Device Cooled:
D2 PAK,TO-263
Attachment Method:
Surface Mount
Dimension:
26.16 x 12.7 x 10.16 mm
Thermal Resistance:
N/A
Finish:
Black Anodized
The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.
Search Keywords:
573300D00010G
IN STOCK:
12,290
Ships today, if you order in
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
750
Factory Lead-Time
6 Weeks
Quantity
Unit Price
Ext. Price
5
$0.981
$4.905
250
$0.760
$190.000
500
$0.725
$362.500
750
$0.697
$522.750
1,500
$0.682
$1,023.000
2,250
$0.670
$1,507.500
3,000
+
$0.636
$1,908.000
Please Note:
Item may be subject to tariff fee if shipping within the United States
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