help desk software
BDN13-3CB/A01 by cts corporation
DATA SHEET

BDN13-3CB/A01

CTS Corporation

Heat Sink Passive Pin Array Adhesive 16.1°C/W Black Anodized .. see full description

RoHS Compliant
Tray Packaging
Accessories
Request Programming Quote
This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
CTS Corporation
Part No:
BDN13-3CB/A01
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1320
Package Type:
Tray
Device Cooled:
N/A
Attachment Method:
Adhesive Tape
Dimension:
33.274 x 33.274 x 9.017 mm
Thermal Resistance:
16.1 °C/W
Finish:
Black Anodized
The CTS CORP part BDN13-3CB/A01 is a heat sink designed for efficient heat dissipation in electronic devices. Featuring a passive pin array design and an adhesive backing, this heat sink offers excellent thermal conductivity with a thermal resistance of 16.1°C/W. Its black anodized finish provides enhanced durability and a sleek, professional look. Perfect for applications where heat management is crucial, the CTS CORP heat sink is a reliable choice to ensure optimal performance and longevity of your electronic components.
Search Keywords:
BDN133CBA01
IN STOCK: 3,125
Can Ship immediately
MOQ for In Stock Qty:
10
MOQ for out of Stock Qty:
330
Factory Lead-Time
10 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
10
$6.77
$67.700
100
$6.67
$667.000
250
$6.57
$1,642.500
330
$6.47
$2,135.100
660
$3.43
$2,263.800
990
$2.41
$2,385.900
1,320 +
$2.36
$3,115.200
Suppliers Standard Package
Tools/3D Models
Request Free CAD Models
Product Guides
PDF Datasheet