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MCP1700T-3302E/TT by microchip technology
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MCP1700T-3302E/TT

Microchip Technology

Fixed LDO Voltage Regulator - 2.3V to 6V - 178mV Dropout - 3.3Vout - 250mAout. .. see full description

RoHS Compliant
REEL Packaging
Accessories
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Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP1700T-3302E/TT
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3000
Package Type:
REEL
Function:
LDO
Junction to Ambient:
336(Typ) °C/W
Family:
MCP1700
Accuracy:
±2 %
Dimension:
2.9 x 1.3 x 0.95 mm
Maximum Input Voltage:
6 V
Junction to Case:
N/A
Maximum Dropout Voltage @ Current:
0.35@250mA V
Load Regulation:
1(Typ) %
Line Regulation:
0.75(Typ) %/V
The MCP1700 is a CMOS low dropout positive voltage regulator which can source up to 250mA of current with an extremely low input-output voltage differential of 178mV at 250mA. The low dropout voltage combined with the low current consumption of only 1.6µA makes this part ideal for battery operation. The low voltage differential (dropout voltage) extends battery operating lifetime. The MCP1700 is stable with 1.0µF ceramic output capacitor. It also permits high currents in small packages when operated with minimum VIN – VOUT differentials. The circuit also incorporates short-circuit protection & over temperature protection to ensure maximum reliability.
Search Keywords:
MCP1700T3302ETT
IN STOCK: 14,000
Can Ship immediately
Minimum Order:
3000
Multiple:
3000
Factory Lead-Time
6 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
3,000
$0.3805
$1,141.500
6,000
$0.3748
$2,248.800
9,000
$0.3692
$3,322.800
12,000
$0.3636
$4,363.200
15,000
$0.3582
$5,373.000
27,000
$0.3528
$9,525.600
51,000 +
$0.3475
$17,722.500
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products
PDF PCN - 18-Dec-2020 - DATA SHEET - MCP1700 LOW QUIESCENT CURRENT DATA SHEET
PDF PCN - 08-Nov-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 11-Jan-2008 - New test site UTAC THAI of 3L SOT-23 packaged analog products to increase production test capacity.
PDF PCN - 18-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 11-Jan-2008 - Qualification of UTAC THAI Limited to Test 3L SOT-23Packaged Analog Products.
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 11-Jan-2008 - QUALIFICATION OF UTAC THAI LIMITED TO TEST 3L SOT-23 PACKAGED ANALOG PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 08-Mar-2007 -
PDF PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 26-Nov-2018 - DATA SHEET - MCP1700 LOW QUIESCENT CURRENT DATA SHEET CHANGE
PDF PCN - 19-Sep-2016 - DATA SHEET DOCUMENT REVISION
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 09-Nov-2007 - QUALIFICATION OF G600 TYPE MOLD COMPOUNDS FOR SOT-23 PACKAGES AT VARIOUS ASSEMBLY SITES
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 3, 5 and 6L SOT-23 package products with SG-
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of the listed 6L SOT-23 package products with SG-8300GM mo
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 17-Oct-2013 - DATA SHEET - MCP1700 DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 19-Sep-2016 - DATA SHEET DOCUMENT REVISION
PDF PCN - 05-Feb-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 18-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jan-2004 -
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 15-Dec-2006 - NEW BILL OF MATERIALS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 11-Jan-2008 - QUALIFICATION OF UTAC THAI LIMITED TO TEST 3L SOT-23 PACKAGED ANALOG PRODUCTS
PDF PCN - 17-Oct-2013 - Microchip has released a new devicedoc for the MCP1700 data sheet of devices in order to improve pro
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 30-Jan-2006 -
PDF PCN - 18-Jan-2008 - Qualification Of Utac Thai Limited To Test 3L Sot-23 Packaged Analog Products
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 31-Jan-2007 - New Bill Of Materials
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Jan-2008 - Qualification Of Utac Thai Limited To Test 3L Sot-23 Packaged Analog Products
PDF PCN - 31-Dec-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 31-Oct-2007 - Qualification Of G600 Type Mold Compounds For Sot-23 Packages At Various Assembly Sites
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS