25LC256-I/SN by microchip technology

25LC256-I/SN

Microchip Technology

EEPROM - Serial SPI - 256Kb (32K x 8) - 10 MHz - 8 Pin SOIC N - Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Set Notification
Request Programming Quote
Accessories

Product Attribute

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Products found: 0

Supplier:

Microchip Technology

Part No:

25LC256-I/SN

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

EAR99

Supplier Standard Pack:

100

Package Type:

TUBE

Data Retention:

200(Min) Year

The 25LC256-I/SN is a 256Kbit serial SPI bus EEPROM (Electrically Erasable Programmable Memory) in 8 pin SOIJ package. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are clock input (SCK), separate data in (SI) and data out (SO) lines. Access to device is controlled through chip select input. Communication to the device can be paused via hold pin. While device is paused, transitions on its inputs will be ignored with exception of chip select allowing host to service higher priority interrupts. It features more than 1 million erase/write cycles and data retention is greater than 200 years.

Product Highlights:

Potential Applications:

Search Keywords:

25LC256ISN

Different packaging options available. See Alternatives

IN STOCK: 5,300

Can Ship immediately

BONDED Quantity:

0

Manufacturer Stock:

6,420 can ship 10/21/24

On Order:

Minimum Order:

100

Available in less than min:

MOQ for out of Stock Qty:

Multiple:

100

Factory Lead-Time

20 Weeks can ship 3/3/25

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

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Min quantity should be greater than or equal () in order to activate the custom price. Otherwise you will get the normal price.

Quantity

Unit Price

Ext. Price

100

$1.417

$141.700

300

$1.382

$414.600

500

$1.369

$684.500

1,000

$1.355

$1,355.000

2,500

$1.341

$3,352.500

5,000

$1.327

$6,635.000

7,500 +

$1.314

$9,855.000

DOWNLOADS

PCN - 11-Nov-2004 -

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 02-Oct-2016 - QUALIFICATION OF G600V MOLDING COMPOUND FOR PRODUCTS AVAILABLE IN 8L SOIC CHIP AT MTAI ASSEMBLY SITE

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 22-Mar-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 08-Jan-2013 - Microchip has released a new devicedoc for the 25AA256/25LC256 device data sheet of devices.

PCN - 07-Apr-2022 - MANUFACTURING CHANGE

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 26-May-2005 -

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 21-Jun-2016 - QUALIFICATION OF G600V MOLDING COMPOUND FOR PRODUCTS AVAILABLE IN 8L SOIC CHIP AT MTAI ASSEMBLY SITE

PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 16-Feb-2022 - MANUFACTURING CHANGE

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 12-Jan-2017 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 23-Jul-2021 - DATA SHEET - 25AA256/25LC256 256K SPI BUS SERIAL EEPROM

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Nov-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 28-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 28-Jun-2005 -

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 23-Sep-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 18-Sep-2018 - 25LCXXX 8K-256K SPI SERIAL EEPROM HIGH TEMP FAMILY DATA SHEET

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 12-Jan-2017 - FINAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 28-Aug-2019 - MICROCHIP HAS RELEASED A NEW PRODUCT DOCUMENTS FOR THE 25AA256/25LC256 DEVICE DATA SHEET OF DEVICES

PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 02-Oct-2016 - QUALIFICATION OF G600V MOLDING COMPOUND FOR PRODUCTS AVAILABLE IN 8L SOIC CHIP AT MTAI ASSEMBLY SITE

PCN - 08-Jan-2013 - DATA SHEET - 25AA256/25LC256 DEVICE DATA SHEET

PCN - 30-Nov-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 22-Sep-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 06-Mar-2006 -

PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 20-Mar-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 26-May-2005 - Product Change Notice

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 06-Mar-2006 - Product Change Notice

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 28-Jun-2005 - Product Change Notice

PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 04-Apr-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 15-Jun-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 11-Nov-2004 - Product Change Notice

PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 04-Mar-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

ALTERNATIVE PRODUCTS

Packaged Differently
In Stock: 6600
Minimum Order Quantity: 250

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