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93LC56BT-I/SN by microchip technology
DATA SHEET

93LC56BT-I/SN

Microchip Technology

EEPROM - Serial-Microwire - 2K(128 x 16) - 3.3V/5V - 8-Pin - SOIC N - Tape&Reel .. see full description

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  • REEL Packaging
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Supplier:
Microchip Technology
Part No:
93LC56BT-I/SN
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
Supplier Standard Pack:
3300
Package Type:
REEL
Data Retention:
200(Min) Year
The 93LC56BT-I/SN is a 2Kbit low-voltage serial Electrically Erasable PROMs(EEPROM). 93LC56BT-I/SN is dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX56A devices are available, while the 93XX56B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/TDFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish.
Search Keywords:
93LC56BTISN
  Different packaging options available.  See Alternatives
IN STOCK: 13,200
Can Ship immediately
Minimum Order:
3300
Multiple:
3300
Factory Lead-Time
5 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
3,300
$0.2780
$917.400
6,600
$0.2752
$1,816.320
9,900
$0.2725
$2,697.750
13,200
$0.2697
$3,560.040
16,500
$0.2670
$4,405.500
26,400
$0.2644
$6,980.160
52,800 +
$0.2617
$13,817.760
DOWNLOADS
PDF Datasheet
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 15-Jun-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 09-Dec-2011 - Microchip has released a new devicedoc for the listed 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 2K microw
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 06-Nov-2003 - Product Change Notice
PDF PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 21-Sep-2006 - QUALIFICATION OF 8L DFN 2X3MM AT AIC
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 28-Jun-2005 - Product Change Notice
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 09-Dec-2011 - DATA SHEET-93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 2K MICROWIRE-COMPATIBLE SERIAL EEPROM
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 04-Mar-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 09-May-2003 - Product Change Notice
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 09-May-2003 - Product Change Notice
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
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