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DSPIC30F4013-30I/P by microchip technology
DATA SHEET

DSPIC30F4013-30I/P

Microchip Technology

MCU - 16-bit dsPIC RISC - 48KB Flash - 2KB SRAM - 1KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 40-Pin PDIP - Tube .. see full description

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
  • Set Notification
  • Request Programming Quote
  • This product may require extra documentation. Shipping may be delayed 1-2 days.
Product Attribute
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Products found: 0
Supplier:
Microchip Technology
Part No:
DSPIC30F4013-30I/P
RoHS:
Yes
HTS:
8542310020
COO:
TH
ECCN:
3A991.a.2
Supplier Standard Pack:
10
Package Type:
TUBE
Program Memory Type:
Flash
ADC Resolution:
12 bit
Program Memory Size:
48 KB
RAM Size:
2 KB
Operating Temperature:
-40 to 85 °C
Number of Programmable I/Os:
30
The MICROCHIP TECH. part DSPIC30F4013-30I/P is a powerful microcontroller unit (MCU) designed for a wide range of applications. Featuring a 16-bit dsPIC RISC architecture, this MCU offers excellent performance and capabilities. It includes 48KB of flash memory for program storage, 2KB of SRAM for data storage, and 1KB of EEPROM for non-volatile data storage.Operating at a temperature range of -40°C to +85°C, this MCU is suitable for use in harsh environmental conditions. It supports multiple supply voltages including 2.5V, 3.3V, and 5V, providing flexibility in various power supply configurations.The DSPIC30F4013-30I/P comes in a 40-pin PDIP package and is supplied in a tube for convenient handling and storage. With its impressive features and wide temperature range, this MCU is an excellent choice for diverse applications requiring reliability and performance.
Search Keywords:
DSPIC30F401330IP
IN STOCK: 130
Can Ship immediately
Manufacturer Stock:
490   can ship 10/28/24
On Order:
300   can ship 11/21/24 
Minimum Order:
10
Multiple:
10
Factory Lead-Time
6 Weeks can ship 11/22/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
10
$7.57
$75.700
30
$7.50
$225.000
50
$7.42
$371.000
100
$7.18
$718.000
250
$7.11
$1,777.500
500
$7.04
$3,520.000
1,000 +
$6.97
$6,970.000
DOWNLOADS
PDF Datasheet
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 05-Nov-2008 - Microchip has qualified G600C Mold compound and 8361J Die attach epoxy for 18L PDIP .300" (Dual Dice
PDF PCN - 01-Dec-2008 - MOLD COMPOUND CHANGE TO G600 & DIE ATTACH EPOXY CHANGE TO 8200T
PDF PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages With Pdcu
PDF PCN - 18-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages
PDF PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in
PDF PCN - 27-Sep-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE
PDF PCN - 18-Nov-2010 - Microchip Has Released A New Devicedoc For The Listed Dspic30F3014/4013 Data Sheet Of Devices.
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.
PDF PCN - 01-Dec-2008 - QUALIFICATION OF 40L PDIP (.6000'') WITH G600 MOLD COMPOUND AT UTL (NSEB) ASSEMBLY
PDF PCN - 09-Feb-2010 - Errata-Dspic30F3014/4013 Family Silicon Errata And Data Sheet Clarification
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages
PDF PCN - 15-Nov-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 18-Nov-2010 - Microchip Has Released A New Devicedoc For The Dspic30F3014/4013 Data Sheet Of Devices.
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 26-Feb-2009 - Microchip has finally qualified G600C Mold compound and 8200T epoxy for 40L PDIP (.600 mil) at UTL (
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 09-Feb-2010 - Errata-Dspic30F3014/4013 Family Silicon Errata And Data Sheet Clarification
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 10-Oct-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 02-Jun-2010 - Errata-Dspic30F3014/4013 Family Silicon Errata And Data Sheet Clarification
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
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