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MCP1703T-3302E/DB by microchip technology
DATA SHEET

MCP1703T-3302E/DB

Microchip Technology

Fixed LDO Voltage Regulator - 2.7 V to 16 V in - 525 mV Dropout - 3.3 V out - 250 mA out - SOT-223-3 - 4-Pin(3+Tab). .. see full description

RoHS Compliant
REEL Packaging
Accessories
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Products found: 0
Supplier:
Microchip Technology
Part No:
MCP1703T-3302E/DB
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
4000
Package Type:
REEL
Junction to Ambient:
62(Typ) °C/W
Accuracy:
±2 %
Junction to Case:
15(Typ) °C/W
Function:
LDO
Load Regulation:
1(Typ) %
Line Regulation:
0.1(Typ) %/V
Maximum Dropout Voltage @ Current:
0.725@250mA V
Dimension:
6.5 x 3.5 x 1.6 mm
Maximum Input Voltage:
16 V
Family:
MCP1703
The MCP1703 is a CMOS, low dropout voltage regulator with 250 mA maximum output current. MCP1703 works with input voltage of up to 16V and in combination with its low current consumption of 2 µA is an ideal solution for applications using multi-cell, 9V alkaline or one-, two- or three- cell lithium-ion batteries. It is available in space efficient SOT23A and SOT89 packages or in a thermally capable 3-pin SOT223.
Search Keywords:
MCP1703T3302EDB
  Different packaging options available.  See Alternatives
IN STOCK: 6,400
Ships today, if you order in
Manufacturer Stock:
656,000   can ship 11/29/24
Minimum Order:
500
Factory Lead-Time
4 Weeks can ship 12/13/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
500
$0.563
$281.500
1,000
$0.557
$557.000
4,000
$0.552
$2,208.000
8,000
$0.546
$4,368.000
12,000
$0.541
$6,492.000
16,000
$0.535
$8,560.000
28,000 +
$0.530
$14,840.000
Suppliers Standard Package
Tools/3D Models
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 31-Oct-2012 - Microchip is announcing the qualification of 3L SOT-223 with conductive die attach at LPI assembly s
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 28-Feb-2013 - Microchip is announcing the qualification of 3L SOT-223 with conductive die attach at LPI assembly s
PDF PCN - 25-Feb-2012 - QUALIFICATION OF 3L & 5L SOT-223 AT LPI ASSEMBLY SITE
PDF PCN - 15-Dec-2011 - Microchip is announcing the qualification of 3L and 5L SOT-223 at LPI assembly site for the listed p
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products
PDF PCN - 18-Oct-2013 - QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT ATP ASSEMBLY SITE
PDF PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-23A at LPI assembly site for the listed products
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 04-Mar-2011 - Data Sheet-Mcp1703 Data Sheet
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Listed Mcp1703 Data Sheet Of Devices.
PDF PCN - 16-Sep-2009 - Microchip Has Released A New Device Document For The Mcp1703 Datasheet Of Devices.
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 04-Mar-2011 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-23A package wit
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Mar-2013 - QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT LPI ASSEMBLY SITE
PDF PCN - 06-Dec-2013 - FINAL NOTICE: QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT ATP ASSEMBLY SITE
PDF PCN - 11-Jan-2013 - QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT LPI ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded