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MCP1703T-5002E/CB by microchip technology
DATA SHEET

MCP1703T-5002E/CB

Microchip Technology

Fixed LDO Voltage Regulator - 2.7V to 16V - 330mV Dropout - 5Vout - 250mAout - SOT-23A - 3-Pin. .. see full description

RoHS Compliant
REEL Packaging
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Supplier:
Microchip Technology
Part No:
MCP1703T-5002E/CB
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3000
Package Type:
REEL
Dimension:
3.1(Max) x 1.8(Max) x 1.3(Max) mm
Family:
MCP1703
Function:
LDO
Accuracy:
±2 %
Junction to Case:
110(Typ) °C/W
Maximum Dropout Voltage @ Current:
0.65@250mA V
Line Regulation:
0.1(Typ) %/V
Maximum Input Voltage:
16 V
Junction to Ambient:
336(Typ) °C/W
Load Regulation:
1(Typ) %
The MCP1703T-5002E/CB is a fixed output CMOS low dropout (LDO) voltage regulator in 3 pin SOT-23A package. The input operating range is specified from 2.7V to 16V making it an ideal choice for two to six primary cell battery powered applications, 9V alkaline and one or two cell Li-Ion powered applications. The output voltage tolerance of MCP1703 is typically ±0.4% at +25°C and ±3% maximum over -40°C to 125°C operating temperature range. Line regulation is ±0.1% typical at 25°C. The LDO output is stable when using only 1μF output capacitance. Ceramic, tantalum or aluminium electrolytic capacitors can all be used for input and output. Overcurrent limit and overtemperature shutdown provide a robust solution for any application.
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MCP1703T5002ECB
IN STOCK: 11,000
Can Ship immediately
Manufacturer Stock:
18,000   can ship 12/6/24
Minimum Order:
500
Factory Lead-Time
7 Weeks can ship 1/10/25  
Enter Quantity
Quantity
Unit Price
Ext. Price
500
$0.549
$274.500
1,000
$0.544
$544.000
3,000
$0.538
$1,614.000
6,000
$0.533
$3,198.000
9,000
$0.527
$4,743.000
12,000
$0.522
$6,264.000
15,000 +
$0.517
$7,755.000
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PDF Datasheet
Product Changes
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 04-Mar-2011 - Data Sheet-Mcp1703 Data Sheet
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-23A package wit
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 16-Sep-2009 - Microchip Has Released A New Device Document For The Mcp1703 Datasheet Of Devices.
PDF PCN - 31-Oct-2012 - Microchip is announcing the qualification of 3L SOT-223 with conductive die attach at LPI assembly s
PDF PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at
PDF PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Listed Mcp1703 Data Sheet Of Devices.
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 15-Dec-2011 - Microchip is announcing the qualification of 3L and 5L SOT-223 at LPI assembly site for the listed p
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products
PDF PCN - 04-Mar-2011 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.
PDF PCN - 30-Jun-2012 - Qualification Of 3L Sot-23A Package With Selective Ag Plating On The Lead-Frame At Lpi Assembly Site
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with
PDF PCN - 15-Nov-2011 - Qualification Of 3L Sot-23A At Lpi Assembly Site
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-23A at LPI assembly site for the listed products
PDF PCN - 30-Aug-2012 - Qualification Of 3L Sot-23A Package With Selective Ag Plating On The Lead-Frame
PDF PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a