help desk software
MCP23S18-E/MJ by microchip technology
DATA SHEET

MCP23S18-E/MJ

Microchip Technology

16-Bit I/O Expander - SPI Interface - 10MHz - 5.5V - Automotive - 24-Pin QFN - Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Request Programming Quote
This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23S18-E/MJ
RoHS:
Yes
HTS:
8542390060
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
91
Package Type:
TUBE
Interface Speed:
10000 kHz
Interface Type:
SPI
Interrupt Output:
Yes
Manual Reset:
Yes
Maximum Operating Supply Voltage:
5.5 V
Dimension:
4 x 4 x 0.83 mm
I2C Bus Interface Mode:
N/R
Family:
MCP23S18
The MCP23S18-E/MJ is a 16-bit I/O expander that utilizes a SPI interface, making it ideal for applications requiring additional I/O pins. This automotive-grade device supports a 10MHz clock frequency and operates within a voltage range of 5.5V. With its 24-pin QFN package and tube packaging, it offers convenient integration and storage. Expand your connectivity options with the MCP23S18-E/MJ and optimize your automotive electronics design.
Search Keywords:
MCP23S18EMJ
  Different packaging options available.  See Alternatives
IN STOCK: 2,634
Ships today, if you order in
Manufacturer Stock:
6,461   can ship 12/2/24
Minimum Order:
91
Multiple:
91
Factory Lead-Time
14 Weeks can ship 2/21/25  
Enter Quantity
Quantity
Unit Price
Ext. Price
91
$1.62
$147.420
182
$1.59
$289.380
273
$1.57
$428.610
546
$1.54
$840.840
1,001
$1.52
$1,521.520
2,548
$1.50
$3,822.000
5,005
$1.48
$7,407.400
7,553 +
$1.45
$10,951.850
Suppliers Standard Package
Tools/3D Models
Request Free CAD Models
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 18-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 31-Oct-2014 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 18-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 02-Nov-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 02-Nov-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem