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MCP6S93T-E/UN by microchip technology
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MCP6S93T-E/UN

Microchip Technology

MCP6S93 Series 5.5 V 18 MHz Single-Ended Rail-to-Rail I/O Low-Gain PGA - MSOP-10 .. see full description

RoHS Compliant
REEL Packaging
Accessories
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Supplier:
Microchip Technology
Part No:
MCP6S93T-E/UN
RoHS:
Yes
HTS:
8542330001
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
2500
Package Type:
REEL
The MCP6S93T-E/UN is a precision analog programmable gain amplifier (PGA) designed for low-power applications. It offers a wide gain range from 1 to 1000, allowing for precise amplification of low-level signals. With low input offset voltage and low noise, this PGA provides excellent signal accuracy and integrity. The MCP6S93T-E/UN operates from a single supply voltage of 2.7V to 5.5V, making it suitable for battery-powered systems and other low-voltage applications. It features a SPI interface for easy digital control of gain settings. With its small size and low power consumption, this PGA is an ideal choice for portable and space-constrained designs.
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MCP6S93TEUN
  Different packaging options available.  See Alternatives
IN STOCK: 1,000
Can Ship immediately
Manufacturer Stock:
2,500   can ship 12/6/24
Minimum Order:
250
Factory Lead-Time
7 Weeks can ship 1/13/25  
Enter Quantity
Quantity
Unit Price
Ext. Price
250
$1.275
$318.750
500
$1.262
$631.000
1,000
$1.249
$1,249.000
2,500
$1.237
$3,092.500
5,000
$1.224
$6,120.000
7,500
$1.212
$9,090.000
10,000 +
$1.200
$12,000.000
Suppliers Standard Package
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PDF Datasheet
Product Changes
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 17-Dec-2008 - Microchip Is Qualifying The Change Of Bill Of Materials For 8L & 10L Msop Package With 8200T Epoxy A
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to
PDF PCN - 20-Mar-2009 - QUALIFICATION OF 8L & 10L MSOP WITH 8200T EPOXY AND G600 MOLD COMPOUND AT UTL ASSEMBLY
PDF PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 28-Feb-2009 - Qualification Of 8L And 10L Msop With 8200T Epoxy And G600 Mold Compound At Utl Assembly
PDF PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi