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PIC12C508A-04/P by microchip technology
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PIC12C508A-04/P

Microchip Technology

MCU 8-bit - One Time Programmable - PIC12 Family PIC12C5xx Series Microcontrollers - 4 MHz - 768 Byte - 3.3V/5V - 8 Pins. .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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Supplier:
Microchip Technology
Part No:
PIC12C508A-04/P
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
60
Package Type:
TUBE
Number of Programmable I/Os:
5
Program Memory Type:
EPROM
ADC Resolution:
N/A
Operating Temperature:
0 to 70 °C
Program Memory Size:
768 B
RAM Size:
25 B
The PIC12C508A-04/P is a 8-bit 8-pin CMOS Microcontroller with high-performance RISC CPU. It employs a RISC architecture with only 33 single word/single cycle instructions. All instructions are single cycle (1 µs) except for program branches which take two cycles. The PIC12C5XX delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit Wide instructions are highly symmetrical resulting in 2:1 code compression over other 8-bit microcontrollers in its class. The easy to use and easy to remember instruction set reduces development time significantly.
Search Keywords:
PIC12C508A04P
IN STOCK: 900
Ships today, if you order in
Minimum Order:
60
Multiple:
60
Factory Lead-Time
6 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
60
$1.383
$82.980
120
$1.369
$164.280
300
$1.356
$406.800
540
$1.342
$724.680
1,020
$1.329
$1,355.580
2,520
$1.315
$3,313.800
5,040
$1.302
$6,562.080
7,500 +
$1.289
$9,667.500
Suppliers Standard Package
Tools/3D Models
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Product Changes
PDF PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE
PDF PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the
PDF PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th
PDF PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 09-Feb-2001 - Product Change Notice
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 15-Jul-2002 - Inchesadding 8L And 14L Windowed Cerdip (0.300Inches)
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP AT MMS ASSEMBLY
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT
PDF PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2
PDF PCN - 11-Jan-2010 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY
PDF PCN - 07-May-2008 - Microchip is qualifying the G600 mold compound for 8L PDIP package at UNIS in order to improve manuf
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 17-Jun-2008 - Microchip is announcing the qualification of G600 mold compound for 8L PDIP package at units for the
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP PACKAGE AT MMS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 19-Sep-2008 - Microchip is qualifying E500 Mold Compound and 84-1LMISR4 Die Attach Epoxy for 8L PDIP Package at MM
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH