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PIC12F675-I/P by microchip technology
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PIC12F675-I/P

Microchip Technology

MCU 8 Bit - Flash - PIC12 Family PIC12F6xx Series Microcontrollers - 20 MHz - 1.75 KB - 64 Byte - 8 Pins. .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
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Supplier:
Microchip Technology
Part No:
PIC12F675-I/P
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
60
Package Type:
TUBE
Operating Temperature:
-40 to 85 °C
ADC Resolution:
10 bit
Number of Programmable I/Os:
68877
RAM Size:
648886B
Program Memory Type:
Flash8885
Program Memory Size:
1.758884KB
The PIC12F675-I/P is a 8-bit flash-based CMOS Microcontroller. The easy-to-program (only 35 single word instructions) CMOS Flash-based 8-bit microcontroller packs Microchip's powerful PIC® MCU architecture into an 8-pin package and features 4 channels for the10-bit Analogue-to-Digital (A/D) converter, 1-channel comparator and 128bytes of EEPROM data memory. The data memory is partitioned into two banks, which contain the general purpose registers and the special function registers. The special function registers are located in the first 32 locations of each bank. Register locations 20h-5Fh are general purpose registers, implemented as static RAM and are mapped across both banks. All other RAM is unimplemented and returns 0 when read. RP0 (STATUS<5>) is the bank select bit.
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PIC12F675IP
IN STOCK: 6,240
Ships today, if you order in
Manufacturer Stock:
129,435   can ship 12/6/24
Minimum Order:
60
Multiple:
60
Factory Lead-Time
4 Weeks can ship 12/20/24  
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 01-Aug-2005 - Qualification Of 8L Dfn At Carsem
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 06-Nov-2003 - Product Change Notice
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 17-Jun-2008 - Microchip is announcing the qualification of G600 mold compound for 8L PDIP package at units for the
PDF PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 21-Sep-2011 - Microchip is releasing the v9.83 HI-Tech C for the listed PIC10/12/16 MCUs in order to provide new s
PDF PCN - 01-May-2010 - Data Sheet-Pic12F629/675 Data Sheet
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 07-May-2008 - Microchip is qualifying the G600 mold compound for 8L PDIP package at UNIS in order to improve manuf
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE
PDF PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 28-May-2010 - QUALIFICATION OF 8L DFN (4X4) PACKAGE WITH CRM1076DJ DIE ATTACH AND G770HCD MOLD COMPOUND
PDF PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP PACKAGE AT MMS
PDF PCN - 27-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic12F629/675 Data Sheet Of Devices.
PDF PCN - 18-Aug-2006 - Qualification Of 8L Dnf 4X4Mm At Unis
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 19-Sep-2008 - Microchip is qualifying E500 Mold Compound and 84-1LMISR4 Die Attach Epoxy for 8L PDIP Package at MM
PDF PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 31-Dec-2006 - Addition Of An Assembly Site
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo
PDF PCN - 01-Sep-2005 - Qualification Of 8L Dfn At Nseb
PDF PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS
PDF PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 27-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic12F629/675 Family Silicon Errata And Data Sheet Cl
PDF PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th
PDF PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP AT MMS ASSEMBLY
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 27-Oct-2009 - Pic12F629/675 Family Silicon Errata And Data Sheet Clarification
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 01-Jun-2013 - Qualification Of 8L Vdfn (4X4X0.9 Mm) At Lpi Assembly Site
PDF PCN - 19-Apr-2010 - Microchip is announcing the Qualification of 8L DFN (4x4) package with CRM1076DJ die attach and G770
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY
PDF PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 27-Oct-2009 - Released A New Devicedoc For The Pic12F629/675 Data Sheet Of Devices
PDF PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the