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PIC16C65B-20/P by microchip technology
DATA SHEET

PIC16C65B-20/P

Microchip Technology

MCU 8-bit PIC RISC 7KB EPROM 5V 40-Pin PDIP Tube .. see full description

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
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Product Attribute
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Products found: 0
Supplier:
Microchip Technology
Part No:
PIC16C65B-20/P
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Supplier Standard Pack:
10
Package Type:
TUBE
RAM Size:
192 B
Operating Temperature:
0 to 70 °C
Program Memory Size:
7 KB
ADC Resolution:
N/A
Program Memory Type:
EPROM
Number of Programmable I/Os:
33
The PIC16C65B-20/P is a 8-bit microcontroller unit (MCU) from MICROCHIP TECH. It features a PIC RISC architecture, offering high performance and efficiency. The MCU is equipped with 7KB of EPROM memory, providing ample storage for program code and data. Operating at a voltage range of 5V, it ensures reliable operation in various applications. The PIC16C65B-20/P comes in a 40-pin PDIP package, making it easy to interface with other components on a circuit board. It is supplied in a protective tube packaging, ensuring safe transportation and handling.
Search Keywords:
PIC16C65B20P
IN STOCK: 50
Ships today, if you order in
Manufacturer Stock:
40   can ship 10/28/24
On Order:
500   can ship 11/21/24 
Minimum Order:
10
Multiple:
10
Factory Lead-Time
11 Weeks can ship 12/27/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
10
$5.522
$55.220
30
$5.421
$162.630
100
$5.190
$519.000
250
$5.138
$1,284.500
500
$5.087
$2,543.500
1,000
$5.036
$5,036.000
2,500
$4.986
$12,465.000
5,000 +
$4.936
$24,680.000
DOWNLOADS
PDF Datasheet
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 10-Oct-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages
PDF PCN - 18-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages
PDF PCN - 01-Dec-2008 - QUALIFICATION OF 40L PDIP (.6000'') WITH G600 MOLD COMPOUND AT UTL (NSEB) ASSEMBLY
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages With Pdcu
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages
PDF PCN - 27-Sep-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT
PDF PCN - 01-Dec-2008 - MOLD COMPOUND CHANGE TO G600 & DIE ATTACH EPOXY CHANGE TO 8200T
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 05-Nov-2008 - Microchip has qualified G600C Mold compound and 8361J Die attach epoxy for 18L PDIP .300" (Dual Dice
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 26-Feb-2009 - Microchip has finally qualified G600C Mold compound and 8200T epoxy for 40L PDIP (.600 mil) at UTL (
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 15-Nov-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 12-Sep-2011 - Qualification Of A Larger Lead Frame Paddle Size In 44L Mqfp Package At Alph (Mmt).
PDF PCN - 01-Apr-2006 - QUALIFICATON OF 44L PLCC AT NEW ASSEMBLY SITE: AIC
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