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PIC18F2321-I/SO by microchip technology
DATA SHEET

PIC18F2321-I/SO

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 28 - Package type: SOIC 28 – Speed 40 MHz - Flash 8 kB – SRAM 512 Bytes – EEPROM 256 Bytes - I/O: 25 – A/D: 10 bit with 10 channels – 04 Timers – MSSP – EUSART .. see full description

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
  • Set Notification
  • Request Programming Quote
  • This product may require extra documentation. Shipping may be delayed 1-2 days.
Product Attribute
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Products found: 0
Supplier:
Microchip Technology
Part No:
PIC18F2321-I/SO
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
Supplier Standard Pack:
27
Package Type:
TUBE
Operating Temperature:
-40 to 85 °C
Number of Programmable I/Os:
25
Program Memory Type:
Flash
Program Memory Size:
8 KB
The MICROCHIP TECH PIC18F2321-I/SO is part of PIC18 family with a 8-Bit RISC microcontroller. It can sustain standard temperature ranges from -40°C to + 125 C, has 28 pin in SOIC-28 package and 40 MHz clock speed. This device has a Flash memory of 08 KB, a SRAM of 512 bytes, EEPROM of 256 bytes, four timers module and 10 channels of 10 bits ADC. This MCU includes MSSP & EUSART communication modules (I2C & SPI modules) with 25 I/O pins. It can be used to achieve various tasks.
Search Keywords:
PIC18F2321ISO
IN STOCK: 810
Can Ship immediately
Manufacturer Stock:
3,361   can ship 10/21/24
Minimum Order:
27
Multiple:
27
Factory Lead-Time
4 Weeks can ship 11/11/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
27
$3.875
$104.625
54
$3.836
$207.144
108
$3.798
$410.184
270
$3.760
$1,015.200
513
$3.722
$1,909.386
1,026
$3.685
$3,780.810
2,511
$3.648
$9,160.128
5,022 +
$3.612
$18,139.464
DOWNLOADS
PDF Datasheet
PDF PCN - 28-Jun-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM
PDF PCN - 31-May-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 18-Jan-2011 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Feb-2011 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 01-Apr-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
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