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PIC18F242T-I/SO by microchip technology
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PIC18F242T-I/SO

Microchip Technology

Microcontroller - PIC 18F - 8-Bit - 40MHz - 23 I/O - 16KB (8K x 16) FLASH - 256 x 8 EEPROM - 768 x 8 RAM - 4.2 to 5.5V - 28-SOIC - T&R.

RoHS Compliant
REEL Packaging
Accessories
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This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
This product may require extra documentation. Shipping may be delayed 1-2 days.
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Supplier:
Microchip Technology
Part No:
PIC18F242T-I/SO
RoHS:
Yes
HTS:
8542310015
ECCN:
3A991.a.2
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1600
Package Type:
REEL
The PIC18F242T-I/SO is high-performance, enhanced flash microcontroller with A/D 5x10b data converter. Operating temperature range is from -40°C to 85°C.
Search Keywords:
PIC18F242TISO
  Different packaging options available.  See Alternatives
IN STOCK: 400
Can Ship immediately
Manufacturer Stock:
9,600   can ship 12/6/24
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
400
Factory Lead-Time
4 Weeks can ship 12/20/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$11.80
$59.000
100
$7.46
$746.000
250
$7.23
$1,807.500
400
$7.16
$2,864.000
800
$7.09
$5,672.000
1,200
$7.02
$8,424.000
1,600 +
$6.95
$11,120.000
Suppliers Standard Package
Tools/3D Models
Request Free CAD Models
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 19-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 06-Apr-2001 - Convert To Sumitomo G-600 Mold Compound In 28L Soic Package At Alph Thailand Assembly Site
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 17-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 09-Sep-2003 - Product Change Notice
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 15-Jul-2002 - MPLAB V5.70 RELEASED
PDF PCN - 08-Mar-2007 - Product Change Notice