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PIC18F258-I/SO by microchip technology
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PIC18F258-I/SO

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 28 - Package type: SOIC 28– Speed 40 MHz - Flash 32 kB – SRAM 1536 Bytes – EEPROM 256 Bytes - I/O: 22 – A/D: 10 bit with 05 channels – 04 Timers – MSSP – CCP – .. see full description

RoHS Compliant
TUBE Packaging
Accessories
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This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
This product may require extra documentation. Shipping may be delayed 1-2 days.
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Products found: 0
Supplier:
Microchip Technology
Part No:
PIC18F258-I/SO
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
27
Package Type:
TUBE
Program Memory Size:
32 KB
Program Memory Type:
Flash
Number of Programmable I/Os:
22
RAM Size:
1.5 KB
Operating Temperature:
-40 to 85 °C
ADC Resolution:
10 bit
The MICROCHIP TECH PIC18F258-I/SO is part of PIC18 family with a 8-Bit RISC microcontroller. It can sustain standard temperature ranges from -40°C to + 85 C, has 28 pin in SOIC-28 package and 40 MHz clock speed. This device has a Flash memory of 32 KB, a SRAM of 1536 bytes, EEPROM of 256 bytes, four timers module and 05 channels of 10 bits ADC. This MCU includes MSSP & USART communication modules (I2C & SPI modules) with 22 I/O pins. It can be used to achieve various tasks.
Search Keywords:
PIC18F258ISO
IN STOCK: 268
Ships today, if you order in
Minimum Order:
5
Factory Lead-Time
7 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$8.83
$44.150
27
$8.52
$230.040
54
$8.43
$455.220
108
$8.35
$901.800
270
$8.26
$2,230.200
513
$8.18
$4,196.340
1,026 +
$8.10
$8,310.600
Suppliers Standard Package
Tools/3D Models
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 15-Jul-2002 - MPLAB V5.70 RELEASED
PDF PCN - 09-Sep-2003 - Product Change Notice
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 19-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 06-Apr-2001 - Convert To Sumitomo G-600 Mold Compound In 28L Soic Package At Alph Thailand Assembly Site
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 17-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER