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PIC18F4431-I/PT by microchip technology
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PIC18F4431-I/PT

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 44 - Package type: TQFP 44 – Speed 40 MHz - Flash 16384 B – SRAM 768 Bytes – EEPROM 256 Bytes - I/O: 36 – A/D: 10 bit with 09 channels – 04 Timers – SSP – 02 x .. see full description

RoHS Compliant
TRAY Packaging
Accessories
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Products found: 0
Supplier:
Microchip Technology
Part No:
PIC18F4431-I/PT
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
160
Package Type:
TRAY
RAM Size:
768 B
Number of Programmable I/Os:
36
Program Memory Size:
16 KB
Program Memory Type:
Flash
Operating Temperature:
-40 to 85 °C
ADC Resolution:
10 bit
The MICROCHIP TECH PIC18F4431-I/PT is part of PIC18 family with a 8-Bit RISC microcontroller. It can sustain standard temperature ranges from -40°C to + 85 C, has 44 pin in TQFP-44 package and 40 MHz clock speed. This device has a Flash memory of 16384 B, a SRAM of 768 bytes, EEPROM of 256 bytes, four timers module and 09 channels of 10 bits ADC. This MCU includes SSP & EUSART communication modules (I2C & SPI modules) with 36 I/O pins. It can be used to achieve various tasks.
Search Keywords:
PIC18F4431IPT
IN STOCK: 313
Can Ship immediately
Manufacturer Stock:
1,760   can ship 12/6/24
Minimum Order:
5
Factory Lead-Time
4 Weeks can ship 12/20/24  
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$7.09
$35.450
25
$6.71
$167.750
50
$6.64
$332.000
160
$6.57
$1,051.200
320
$6.51
$2,083.200
640
$6.44
$4,121.600
1,120 +
$6.38
$7,145.600
Suppliers Standard Package
Tools/3D Models
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Product Guides
PDF Datasheet
Product Changes
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 16-Sep-2010 - Microchip Has Released A New Devicedoc For The Pic18F2331/2431/4331/4431 Data Sheet Of Devices.
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 16-Sep-2010 - Microchip Has Released A New Devicedoc For The Pic18F2331/2431/4331/4431 Data Sheet Of Devices.
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI