44769-1402
Molex / WaldomConn Wire to Board RCP 14 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray
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Products found: 0
Supplier:
Molex / Waldom
Part No:
44769-1402
RoHS:
Yes
HTS:
8536694040
COO:
US
ECCN:
EAR99
Supplier Standard Pack
1
Package Type:
Tray
Type:
Wire to Board
Body Orientation:
Straight
Gender:
RCP
Mounting:
Through Hole
Pitch:
3 mm
Number of Contacts:
14
Maximum Voltage Rating:
250 V
Maximum Current Rating:
5/Contact A
Termination Method:
Solder
Operating Temperature:
-40 to 105 °C
Conn Wire to Board RCP 14 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray
Search Keywords:
447691402
IN STOCK:
278
Can Ship immediately
Minimum Order:
20
Factory Lead-Time
20 Weeks
Quantity
Unit Price
Ext. Price
20
$4.29
$85.800
80
$4.23
$338.400
200
$4.15
$830.000
350
$4.07
$1,424.500
2,160
$3.99
$8,618.400
2,500
$3.48
$8,700.000
5,000
+
$3.02
$15,100.000
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