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658-45ABT4E by wakefield
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658-45ABT4E

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Black Anodized .. see full description

RoHS Compliant
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Products found: 0
Supplier:
Wakefield
Part No:
658-45ABT4E
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1000
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
27.9 x 27.9 x 11.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized
The WAKEFIELD part 658-45ABT4E is a high-performance heat sink designed to dissipate heat from a passive BGA pin array. It features a black anodized finish for enhanced thermal conductivity and durability. With its adhesive backing, installation is quick and easy, ensuring efficient heat transfer and temperature regulation. Upgrade your system's cooling capabilities with this reliable and efficient heat sink solution.
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65845ABT4E
IN STOCK: 0
On Order:
1,000   can ship 3/7/25 
MOQ for In Stock Qty:
250
MOQ for out of Stock Qty:
250
Factory Lead-Time
14 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
250
$3.46
$865.000
500
$2.13
$1,065.000
750
$1.68
$1,260.000
1,000 +
$1.65
$1,650.000
Suppliers Standard Package
Please Note: Item may be subject to tariff fee if shipping within the United States
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