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Products found: 0
Supplier:
Wakefield
Part No:
662-15AG
Alias/AKA:
66215AGANO
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack 
720
Package Type:
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
43.5 x 43.5 x 3.8 mm
Thermal Resistance:
N/A
Finish:
Gold Iridite
The WAKEFIELD part 662-15AG is a highly efficient and innovative passive heat sink designed specifically for BGA pin arrays. With its adhesive gold iridite coating, this heat sink offers superior thermal management and optimized heat dissipation for BGA components. The compact design ensures easy installation and helps maintain optimal temperature levels, preventing overheating and prolonging the lifespan of your electronic devices. Upgrade your cooling system with the WAKEFIELD 662-15AG and experience enhanced performance and reliability.
Search Keywords:
66215AG
IN STOCK:
1,069
Ships today, if you order in
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
360
Factory Lead-Time
14 Weeks
Quantity
Unit Price
Ext. Price
5
$8.33
$41.650
100
$8.20
$820.000
250
$8.08
$2,020.000
360
$7.96
$2,865.600
720
$4.21
$3,031.200
1,080
$2.96
$3,196.800
1,440
+
$2.90
$4,176.000
Please Note:
Item may be subject to tariff fee if shipping within the United States
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